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Company records / coolsemtechnologies.com

CoolSem Technologies

CoolSem Technologies (coolsemtechnologies.com): 1 change recorded in its website history since February 2025. Homepage last checked 6 November 2026.

Recorded changes

Newest observations first. Each interval bounds when the website changed; it is not an exact event date.

  1. FundingBetween and

    Announced on its homepage: “€500,000 in additional early-stage funding secured CoolSem secures €500,000 in additional early-stage funding.”.

    Observed on the company’s website; business claims are not independently verified.

    earlier archived pagelater archived pageLink to observation

First recorded website

Observed 15 January 2026

Our earliest capture with readable facts. This is our first observation, not when the company introduced these things. These website claims are not independently verified.

How it described itself

Advancing chip fundamentals through material and thermal innovation.

CoolSem’s patented wafer-level thermal management technology helps chips run cooler, last longer, and perform beyond today’s limits.

Homepage

Funding statements on the website
€500,000 in additional early-stage funding secured CoolSem secures €500,000 in additional early-stage funding.

archived pageLink to first observation

All facts above belong to this capture. Unlisted fields mean we have no readable observation, not that they were absent.

How it describes itself

Similar headlines are grouped together. The quote shown is from the last capture in each group, not necessarily the exact wording throughout that period.

  1. January 2026 – November 2026 · 3 captures · latest observed messagingAdvancing chip fundamentals through material and thermal innovation.

    CoolSem’s patented wafer-level thermal management technology helps chips run cooler, last longer, and perform beyond today’s limits.

    This wording observed 6 November 2026.

    current websiteHistorical capture not publicly available
    Inspect 3 captures in this group
    • 15 January 2026 · Advancing chip fundamentals through material and thermal innovation. archived page
    • 2 September 2026 · Advancing chip fundamentals through material and thermal innovation. archived page
    • 6 November 2026 · Advancing chip fundamentals through material and thermal innovation. current websiteHistorical capture not publicly available

Cite this record

StartupHistory, “CoolSem Technologies” company record, https://startuphistory.org/c/coolsemtechnologies.com

Machine-readable: /c/coolsemtechnologies.com.json. How changes are found: method.