{
  "company": {
    "name": "Eliyan",
    "website": "https://eliyan.com/",
    "record": "https://startuphistory.org/c/eliyan.com"
  },
  "status": null,
  "history_since": "2022-11-08T16:25:23.000Z",
  "baseline": {
    "snapshot_id": "f8dcb2afe192ccde0db3e34ba6020d8e4cae0cdb0ee9efa931bc3ea1356491dd",
    "observed_at": "2022-11-08T16:25:23.000Z",
    "headline": null,
    "description": "Eliyan’s Interconnect technology built with standard organic chip packaging delivers the same performance as advanced packaging technology, and enables The",
    "evidence": "https://web.archive.org/web/20221108162523/https://eliyan.com/",
    "evidence_kind": "internet_archive",
    "facts": null,
    "basis": "first_observation",
    "is_change": false
  },
  "live_captures": 1,
  "last_checked": "2026-11-05T13:50:13.304Z",
  "live_status": null,
  "messaging": [
    {
      "quote_observed_at": "2026-11-05T13:50:13.304Z",
      "variants": [
        {
          "headline": "The Ultimate Chiplet Interconnect. - Eliyan - Home",
          "subhead": "Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2023-03-24T02:09:40.000Z",
          "evidence": "https://web.archive.org/web/20230324020940/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "The Ultimate Chiplet Interconnect. - Eliyan - Home",
          "subhead": "Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2023-08-23T01:36:12.000Z",
          "evidence": "https://web.archive.org/web/20230823013612/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "The Ultimate Chiplet Interconnect. Period.",
          "subhead": "Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2024-03-04T09:37:16.000Z",
          "evidence": "https://web.archive.org/web/20240304093716/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "The Ultimate Chiplet Interconnect. Period.",
          "subhead": "Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2024-07-18T23:06:22.000Z",
          "evidence": "https://web.archive.org/web/20240718230622/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "The Ultimate Chiplet Interconnect. Period.",
          "subhead": "Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2025-01-13T19:11:26.000Z",
          "evidence": "https://web.archive.org/web/20250113191126/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "The Ultimate Chiplet Interconnect. Period.",
          "subhead": "Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2025-07-12T12:10:41.000Z",
          "evidence": "https://web.archive.org/web/20250712121041/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "The Ultimate Chiplet Interconnect. Period.",
          "subhead": "Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2025-08-03T13:36:27.000Z",
          "evidence": "https://web.archive.org/web/20250803133627/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "The Ultimate Chiplet Interconnect. - Eliyan - Home",
          "subhead": "Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2025-11-02T15:18:38.000Z",
          "evidence": "https://web.archive.org/web/20251102151838/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "The Ultimate Chiplet Interconnect. - Eliyan - Home",
          "subhead": "Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2026-01-13T02:22:53.000Z",
          "evidence": "https://web.archive.org/web/20260113022253/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "The Ultimate Chiplet Interconnect. - Eliyan - Home",
          "subhead": "Connected Intelligence at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2026-07-10T14:44:32.000Z",
          "evidence": "https://web.archive.org/web/20260710144432/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "Connected Intelligence - Eliyan - Home",
          "subhead": "Connected Intelligence at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2026-10-17T04:02:14.000Z",
          "evidence": "https://web.archive.org/web/20261017040214/https://eliyan.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "Connected Intelligence - Eliyan - Home",
          "subhead": "Connected Intelligence at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
          "observed_at": "2026-11-05T13:50:13.304Z",
          "evidence": "https://eliyan.com/",
          "evidence_kind": "live_capture"
        }
      ],
      "headline": "Connected Intelligence - Eliyan - Home",
      "subhead": "Connected Intelligence at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.",
      "from": "2023-03-24T02:09:40.000Z",
      "to": "2026-11-05T13:50:13.304Z",
      "captures": 12,
      "evidence": "https://eliyan.com/",
      "evidence_kind": "live_capture",
      "seen": {
        "between": {
          "from": "2023-03-24T02:09:40.000Z",
          "to": "2026-11-05T13:50:13.304Z"
        }
      },
      "current": true
    }
  ],
  "changes": [
    {
      "n": 1,
      "id": "page-f8dcb2afe192ccde0db3e34ba6020d8e4cae0cdb0ee9efa931bc3ea1356491dd:b1ac957d796f4adbf77b6ad7974967edf6d9e27d2cc0874be248158f24356bd1:hiring:20dd4c09cc4ab0aa",
      "before_evidence": "https://web.archive.org/web/20221108162523/https://eliyan.com/",
      "before_evidence_kind": "internet_archive",
      "kind": "hiring",
      "label": "Hiring",
      "summary": "Added a careers page.",
      "between": {
        "from": "2022-11-08T16:25:23.000Z",
        "to": "2023-03-24T02:09:40.000Z"
      },
      "evidence": "https://web.archive.org/web/20230324020940/https://eliyan.com/",
      "evidence_kind": "internet_archive",
      "basis": "page_facts",
      "topic": "https://startuphistory.org/t/added-careers-page"
    },
    {
      "n": 2,
      "id": "page-c06936d4b4371dcd5b2b41438cc614be245d2c5672daccf6e3cffbcd3ac7de8e:9ae856cad4462dbf08c791ce0590ace43d14480fe59d12f92343dbdc7f797072:headline:7fe82aed9c116b8f",
      "before_evidence": "https://web.archive.org/web/20260710144432/https://eliyan.com/",
      "before_evidence_kind": "internet_archive",
      "kind": "headline",
      "label": "Headline",
      "summary": "Changed its homepage headline from “The Ultimate Chiplet Interconnect. - Eliyan - Home” to “Connected Intelligence - Eliyan - Home”.",
      "between": {
        "from": "2026-07-10T14:44:32.000Z",
        "to": "2026-10-17T04:02:14.000Z"
      },
      "evidence": "https://web.archive.org/web/20261017040214/https://eliyan.com/",
      "evidence_kind": "internet_archive",
      "basis": "page_facts",
      "topic": null
    }
  ],
  "update": null,
  "method": {
    "version": "messaging-v1",
    "description": "https://startuphistory.org/method"
  },
  "license": "CC-BY-4.0",
  "cite": "StartupHistory, “Eliyan” company record, https://startuphistory.org/c/eliyan.com"
}