{
  "company": {
    "name": "Arieca",
    "website": "https://arieca.com/",
    "record": "https://startuphistory.org/c/arieca.com"
  },
  "status": null,
  "history_since": "2018-03-25T06:42:20.000Z",
  "baseline": {
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    "observed_at": "2018-03-25T06:42:20.000Z",
    "headline": "arieca.com",
    "description": "Get your own corner of the Web for less! Register a new.COM for just $9.99 for the first year and get everything you need to make your mark online — website builder, hosting, email, and more.",
    "evidence": "https://web.archive.org/web/20180325064220/http://arieca.com/",
    "evidence_kind": "internet_archive",
    "facts": null,
    "basis": "first_observation",
    "is_change": false
  },
  "live_captures": 1,
  "last_checked": "2026-11-05T11:25:51.780Z",
  "live_status": null,
  "messaging": [
    {
      "quote_observed_at": "2021-01-19T23:53:29.000Z",
      "variants": [
        {
          "headline": "arieca.com",
          "subhead": "Get your own corner of the Web for less! Register a new.COM for just $9.99 for the first year and get everything you need to make your mark online — website builder, hosting, email, and more.",
          "observed_at": "2018-03-25T06:42:20.000Z",
          "evidence": "https://web.archive.org/web/20180325064220/http://arieca.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "Arieca – Creators of Thubber",
          "subhead": "Creators of Thubber",
          "observed_at": "2020-06-08T02:14:33.000Z",
          "evidence": "https://web.archive.org/web/20200608021433/https://arieca.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "Arieca – Creators of Thubber",
          "subhead": "Creators of Thubber",
          "observed_at": "2021-01-19T23:53:29.000Z",
          "evidence": "https://web.archive.org/web/20210119235329/https://arieca.com/",
          "evidence_kind": "internet_archive"
        }
      ],
      "headline": "Arieca – Creators of Thubber",
      "subhead": "Creators of Thubber",
      "from": "2018-03-25T06:42:20.000Z",
      "to": "2021-01-19T23:53:29.000Z",
      "captures": 3,
      "evidence": "https://web.archive.org/web/20210119235329/https://arieca.com/",
      "evidence_kind": "internet_archive",
      "seen": {
        "between": {
          "from": "2018-03-25T06:42:20.000Z",
          "to": "2021-01-19T23:53:29.000Z"
        }
      },
      "current": false
    },
    {
      "quote_observed_at": "2024-07-05T15:25:26.000Z",
      "variants": [
        {
          "headline": "Modern Materials for a Connected Society",
          "subhead": "Liquid Metal Embedded Elastomers Modern Materials for a Connected Society Liquid Metal Embedded Elastomers (LMEE) form the basis for extremely deformable, high-performance, multi-functional materials ",
          "observed_at": "2022-07-17T01:27:15.000Z",
          "evidence": "https://web.archive.org/web/20220717012715/https://arieca.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "Modern Materials for a Connected Society",
          "subhead": null,
          "observed_at": "2023-09-26T12:54:50.000Z",
          "evidence": "https://web.archive.org/web/20230926125450/https://www.arieca.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "Modern Materials for a Connected Society",
          "subhead": null,
          "observed_at": "2024-07-05T15:25:26.000Z",
          "evidence": "https://web.archive.org/web/20240705152526/https://www.arieca.com/",
          "evidence_kind": "internet_archive"
        }
      ],
      "headline": "Modern Materials for a Connected Society",
      "subhead": null,
      "from": "2022-07-17T01:27:15.000Z",
      "to": "2024-07-05T15:25:26.000Z",
      "captures": 3,
      "evidence": "https://web.archive.org/web/20240705152526/https://www.arieca.com/",
      "evidence_kind": "internet_archive",
      "seen": {
        "between": {
          "from": "2022-07-17T01:27:15.000Z",
          "to": "2024-07-05T15:25:26.000Z"
        }
      },
      "current": false
    },
    {
      "quote_observed_at": "2026-11-05T11:25:51.780Z",
      "variants": [
        {
          "headline": "A new era of thermal interface materials for semiconductor cooling.",
          "subhead": null,
          "observed_at": "2025-07-10T13:07:51.000Z",
          "evidence": "https://web.archive.org/web/20250710130751/https://www.arieca.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "A new era of thermal interface materials for semiconductor cooling.",
          "subhead": null,
          "observed_at": "2025-11-03T17:32:13.000Z",
          "evidence": "https://web.archive.org/web/20251103173213/https://www.arieca.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "A new era of thermal interface materials for semiconductor cooling.",
          "subhead": null,
          "observed_at": "2026-07-14T00:11:32.000Z",
          "evidence": "https://web.archive.org/web/20260714001132/https://www.arieca.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "A new era of thermal interface materials for semiconductor cooling.",
          "subhead": null,
          "observed_at": "2026-07-14T00:11:32.000Z",
          "evidence": "https://web.archive.org/web/20260714001132/https://www.arieca.com/",
          "evidence_kind": "internet_archive"
        },
        {
          "headline": "A new era of thermal interface materials for semiconductor cooling",
          "subhead": null,
          "observed_at": "2026-11-05T11:25:51.780Z",
          "evidence": "https://www.arieca.com/",
          "evidence_kind": "live_capture"
        }
      ],
      "headline": "A new era of thermal interface materials for semiconductor cooling",
      "subhead": null,
      "from": "2025-07-10T13:07:51.000Z",
      "to": "2026-11-05T11:25:51.780Z",
      "captures": 5,
      "evidence": "https://www.arieca.com/",
      "evidence_kind": "live_capture",
      "seen": {
        "between": {
          "from": "2025-07-10T13:07:51.000Z",
          "to": "2026-11-05T11:25:51.780Z"
        }
      },
      "current": true
    }
  ],
  "changes": [
    {
      "n": 1,
      "id": "page-994d7c269e59f778b375ae8c87529bacb81ea9d6e5b8eaa721de8b4d96905fba:5b4d0bada9360e639997ebc1db5588542f9dd4657ec24e32e57842be9f65a385:hiring:20dd4c09cc4ab0aa",
      "before_evidence": "https://web.archive.org/web/20180325064220/http://arieca.com/",
      "before_evidence_kind": "internet_archive",
      "kind": "hiring",
      "label": "Hiring",
      "summary": "Added a careers page.",
      "between": {
        "from": "2018-03-25T06:42:20.000Z",
        "to": "2020-06-08T02:14:33.000Z"
      },
      "evidence": "https://web.archive.org/web/20200608021433/https://arieca.com/",
      "evidence_kind": "internet_archive",
      "basis": "page_facts",
      "topic": "https://startuphistory.org/t/added-careers-page"
    },
    {
      "n": 2,
      "id": "classifier-b07e6e10ed918acd20154beca67b3837ec7c1f889dddfd034b913cbd5d4cd1cd:8792851a68a46a930641a9fd57cc979cccb2440539655f01d45a9a9f3d9d0b8b:repositioning",
      "before_evidence": "https://web.archive.org/web/20240705152526/https://www.arieca.com/",
      "before_evidence_kind": "internet_archive",
      "kind": "repositioning",
      "label": "Messaging",
      "summary": "Changed its homepage headline from “Modern Materials for a Connected Society” to “A new era of thermal interface materials for semiconductor cooling.”.",
      "between": {
        "from": "2024-07-05T15:25:26.000Z",
        "to": "2025-07-10T13:07:51.000Z"
      },
      "evidence": "https://web.archive.org/web/20250710130751/https://www.arieca.com/",
      "evidence_kind": "internet_archive",
      "basis": "classifier",
      "topic": "https://startuphistory.org/t/repositioned"
    }
  ],
  "update": {
    "headline": "Arieca highlights thermal interface materials for semiconductor cooling",
    "summary": "Arieca’s homepage wording now emphasizes thermal interface materials for semiconductor cooling, and it previously added a careers page. A classifier read the homepage change as a repositioning toward semiconductor cooling applications.",
    "points": [
      {
        "text": "Between July 2024 and July 2025, a classifier read Arieca’s homepage change from “Modern Materials for a Connected Society” to “A new era of thermal interface materials for semiconductor cooling.” as a repositioning toward semiconductor cooling applications.",
        "kind": "interpretation",
        "changes": [
          2
        ]
      },
      {
        "text": "Between July 2024 and July 2025, Arieca changed its homepage headline from “Modern Materials for a Connected Society” to “A new era of thermal interface materials for semiconductor cooling.”",
        "kind": "fact",
        "changes": [
          2
        ]
      },
      {
        "text": "Between March 2018 and June 2020, Arieca added a careers page.",
        "kind": "fact",
        "changes": [
          1
        ]
      }
    ],
    "written_at": "2026-11-07T20:34:24.791Z",
    "basis": "ai_analysis",
    "model": "gpt-5.1-2025-11-13"
  },
  "method": {
    "version": "messaging-v1",
    "description": "https://startuphistory.org/method"
  },
  "license": "CC-BY-4.0",
  "cite": "StartupHistory, “Arieca” company record, https://startuphistory.org/c/arieca.com"
}